OR-MEP is announcing measure and incentive updates, including increased incentives for the Menu and Bundled Paths, measures that are no longer eligible for incentives, and revisions to the Whole Building Path requirements.

For more details on these updates, view the updated Program Manual. These measure and incentive updates are also reflected in the updated Incentives at a Glance document.

Menu and Bundled Path Measure and Incentive Updates

These updates apply to incentive reservations starting with the Open Enrollment 2024 Round 2 (2024-R2) selected projects. The new incentives and measure updates are not available for any projects with incentive reservations prior to Open Enrollment 2024-R2.

Contractor on clipboard taking notes

  • Increased incentives to close the incentive gap between Menu/Bundled and Whole Building Path projects (see OR-MEP Program Manual v. 2024 for details)

  • Updated the incentive units for select measures to better scale with the true size of the homes (e.g., ductless heat pump incentives are scaled with the equipment size (tons) instead of number of units)

  • Removed the following measures from Menu and Bundled paths:

  • Thermostats (smart and 7-day programmable)
  • Low flow fixtures
  • Window or portable AC

  • Lighting (eligible for Tailored Measure with preapproval)

Measures Eliminated from All Paths (Including Whole Building Path)

The following measures are no longer eligible for incentives in any pathway:

  • Smart or 7-day programmable thermostats
  • Low flow fixtures

New Whole Building Path Requirements

  • All known measures that lead to electric savings must be modeled and documented in the Energy Efficiency Plan

  • To pursue the Whole Building Path, the project must include measures in each of the following categories:

Primary Heating Equipment

Improved primary heating equipment must be a heat pump (no electric resistance or radiant heating)

Water Heating Equipment

Improved domestic hot water equipment must be a heat pump water heater

Envelope

There must be improvements to an envelope component